Ahmedabad: Alumni of Gujarat Technological University (GTU) & PhD student Jimil M. Shah is the 2018 recipient of ASME’s Electronics and Photonics Packaging Division (EPPD) Student Member of the Year Award. This prestigious award, given to only one individual annually, is to recognize a current student who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging. The plaque was presented at the ASME InterPACK, EPPD, and JEP Awards Plaque Presentation at Hilton San Francisco Financial District, San Francisco, CA.
Jimil has earlier received “Innovative Project Award” during his Bachelors’ by GTU Innovation Council. He has an industrial experience in production at FIAT India Limited, Pune and as a lecturer at Parul University, Vadodara in India. Prof.(Dr) Navin Sheth, Vice Chancellor of GTU has conveyed congratulations to GTU alumni. Jimil is a doctoral candidate in Mechanical and Aerospace Engineering department at USA. He is working on “An In-depth understanding of Immersion Cooling strategies for data centers”; and “Impact of particulate and gaseous contamination on IT equipment where air side economizers are implemented”at NSF I/UCRC in Energy Efficient Systems; and Electronics, MEMS and Nanoelectronics Systems Packaging Center under guidance of Dr. Agonafer. He has also interest in environmental effects on the reliability of wearables.
“This recognition affirms MAE and UTA’s standing within the EPPD community,” said Mechanical and Aerospace Engineering Department Chair Erian Armanios. He is advised by Dr. Dereje Agonafer in Mechanical Engineering. Jimil is a student member of ASHRAE and ASME. He is the recipient of College of Engineering Summer 2018 Dean’s Dissertation Fellowship and I-Engage Mentoring Program Scholarship, UTA. He has received the “Best Student Abstract Award” at IMAPS 2015, Los Gatos, CA. He has also been the recipient of the 2015-2016 Electronic, MEMS and Nanoelectronics Systems Packaging Center Scholarship Award at UTA. He has publications on Contamination and Corrosion of IT Equipment and Reliability of Oil Immersion Cooling including a paper on contamination that has appeared on a special issue of ASME Journal of Electronic Packaging.
“The award is in recognition and encouragement of your outstanding achievements and service to the field of Electronic and Photonic Packaging thus far. Congratulations on behalf of the entire division! We look forward to your continued progress and accomplishments,” wrote Kaustubh Nagarkar (GE Corporate), General Chair of the ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK2018), August 28-30, 2018, San Francisco, CA, USA.
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